Bulk packaging in semiconductor packages refers to the process of obtaining individual chips by processing the tested wafers according to product model and function requirements. The packaging process is as follows: the wafer from the wafer front-end process is diced into small dies by the dicing process, and then the diced wafer is glued to the island of the corresponding substrate (lead frame) , And then connect the bond pads of the chips to the corresponding leads of the substrate with ultrafine metal (gold, tin, copper and aluminum) wires or conductive resin to form the required circuits; then Independent chips are encapsulated and protected with a plastic case. After the plastic package, a series of operations are also performed. After the package is completed, the finished product is tested. Usually, the product is tested by Incoming, Test and Packing, and finally delivered to the warehouse.